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Clean Upgrade: Automatic Dust Remover Protects the Production Line

Clean Upgrade: Automatic Dust Remover Protects the Production Line插图

Definition

An automatic dust remover is a device specially used to remove dust, static electricity, and other tiny particles of impurities from the surface of a PCB (printed circuit board). It ensures that the surface of the PCB is kept clean before entering the patch or welding process in a fully automated way to improve the reliability of subsequent processes and product quality.

Core Function

  • Remove dust, particles, oil, or other impurities attached to the PCB surface.
  • Eliminate static electricity on the PCB surface to avoid mounting deviation or damage to electronic components caused by static electricity accumulation.

Equipment features

  • PLC control, color human-machine interface operation.
  • Standard SMEMA signal communication method.
  • Non-contact ion wind dust removal, negative pressure dust collection, no contact with the product surface.

Working Principle

  • Cleaning part: Physically remove foreign matter on the surface through a soft roller brush, dust suction device, or airflow cleaning technology.
  • Static elimination: Release positive and negative ions through a static elimination device (such as an ion fan or ion rod) to neutralize static electricity on the PCB surface.
  • Adsorption collection: Collect the cleaned dust through a vacuum adsorption device to keep the environment clean.

Equipment advantages

  • Improve production quality: clean the PCB surface and reduce mounting or welding defects caused by pollutants.
  • Reduce rework rate: effectively avoid electrostatic damage and poor welding, and improve the yield rate.
  • Improve production efficiency: automated operation reduces manual intervention and is suitable for an efficient production environment.
  • Strong compatibility: with high flexibility, can adapt to PCBs of different sizes and types.

Application scenarios

Fully automatic dust removal machines are usually located at the front or middle of the SMT production line, for example:

Before the patch process: ensure that the PCB surface is clean to prevent dust from affecting the patch accuracy.

Before the printing process: prevent dust from affecting the printing quality of solder paste.

Before the welding process: eliminate impurities to ensure the reliability and conductivity of the solder joints.

Application areas

  • Consumer electronics: smartphones, tablets, laptops
  • Automotive electronics: autonomous driving and ADAS systems
  • Medical devices: medical diagnostic equipment and monitoring equipment
  • Aerospace and military: navigation equipment and control systems
  • LED display and lighting industry: high-precision LED display screens
  • Semiconductor manufacturing: packaging and testing equipment
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