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The benefits include improved solder joint quality, reduced oxidation, increased throughput, lower defect rates, and the ability to solder a wider range of component types and sizes.

The process can be adjusted to accommodate both leaded and lead-free solder materials. The controlled atmosphere helps in achieving better wetting and reduced thermal stress on components, which is particularly beneficial for the more sensitive lead-free solders.

The Nitrogen/Air Wave Solder process is a soldering technique used in electronics manufacturing to join electronic components to a printed circuit board (PCB). It utilizes a mixture of nitrogen and air to create a stable atmosphere that minimizes oxidation during the soldering process, resulting in a higher quality solder joint.

Nitrogen is used to displace oxygen in the soldering environment. This reduces oxidation of the solder and the components, which can lead to improved solder joint quality and fewer defects.

Lead-free wave soldering is a process in which molten liquid solder, with the help of a power pump, forms a solder wave of a specific shape on the liquid surface of the solder tank. The PCB with components inserted is placed on a conveyor belt, and the solder joints are welded by passing through the solder wave at a specific angle and a certain immersion depth.

SA series lead-free wave solder with built-in flux spray system, after preheating and heat preservation, and finally solder in tin furnace.
（Note: Maximum plate width can be 350mm, 450mm or 610mm.)