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Vacuum Reflow Soldering

  •  High vacuum with low bubbles, reducing voids in the soldering surface.
  • High wettability, improving soldering quality.
  • Optimized soldering parameters and processes, enhancing production efficiency.
  •  Reduce oxidation and reduce the risk of cold solder joints.

Specifications

Model VTS-1013-N
Equipment parameters Overall dimensions 6567*1420*1520mm
Plate size 70*50mm-300*350mm
Number of heating zones 9
Length of heating zones 3420
Number of cooling zones Upper 3
Cooling method Water cooling – external chiller
Process edge Standard 5mm, customizable
Plate height 25mm on the board, 15mm below the board
Transmission parameters Transmission mode Chain
Transmission control mode Heating zone and vacuum section servo + cooling zone frequency conversion
Transmission speed 200-2400mm/min
Transmission height 900±20
Transmission direction L-R or R-L
Vacuum parameters Number of vacuum zones 1
Ultimate vacuum pressure 10-100pa
Vacuum pumping speed 60 cubic meters/hour, adjustable
Minimum cycle for vacuum welding 25Sec (action time can be set)
Release method Nitrogen quick release
Vacuum chamber operation method Servo control
Vacuum zone track Servo width and narrow adjustment
Flux recovery system Independent vacuum zone recovery device
Control parameters Control mode PC+Siemens PLC
Temperature control mode PID+SSR
Temperature control range Normal temperature -350℃
Temperature control accuracy ±1℃
Heat-up time ≤30min
Heat conduction mode Hot air independent temperature zone circulation, variable frequency speed regulation
Startup/normal operation power Startup: 45KW, normal operation 15KW
Power failure protection UPS endurance operation
MES data Secondary development possible
Nitrogen device Nitrogen filling method The whole area is filled with nitrogen, and the vacuum area is sampled.
Nitrogen flow rate 100-1000ppm @35 cubic meters/hour, nitrogen purity 99.999%

Product Features

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